Raddrizzatori - Singoli
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CategoriaSemiconduttori / Diodi e raddrizzatori / Raddrizzatori - Singoli
Record 34.936
Pagina 847/1165
Immagine |
Numero parte |
Produttore |
Descrizione |
Disponibile |
Quantità |
Serie | Tipo di diodo | Tensione - Inversione CC (Vr) (Max) | Corrente - Media Rettificata (Io) | Tensione - Avanti (Vf) (Max) @ If | Velocità | Tempo di recupero inverso (trr) | Corrente - Perdita inversa @ Vr | Capacità @ Vr, F | Tipo di montaggio | Pacchetto / Custodia | Pacchetto dispositivo fornitore | Temperatura di esercizio - Giunzione |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Infineon Technologies |
DIODE GEN PURP 600V 20A WAFER |
6.120 |
|
- | Standard | 600V | 20A (DC) | 1.95V @ 20A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -40°C ~ 175°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 10A WAFER |
8.820 |
|
- | Standard | 600V | 10A (DC) | 1.25V @ 10A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 15A WAFER |
6.534 |
|
- | Standard | 600V | 15A (DC) | 1.6V @ 15A | Fast Recovery =< 500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -40°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 22.5A WAFER |
2.610 |
|
- | Standard | 600V | 22.5A (DC) | 1.6V @ 22.5A | Fast Recovery =< 500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -40°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 15A WAFER |
2.808 |
|
- | Standard | 600V | 15A (DC) | 1.25V @ 15A | Standard Recovery >500ns, > 200mA (Io) | - | 250µA @ 600V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 22.5A WAFER |
3.096 |
|
- | Standard | 600V | 22.5A (DC) | 1.6V @ 22.5A | Fast Recovery =< 500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -40°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 1.2KV 7A WAFER |
5.832 |
|
- | Standard | 1200V | 7A (DC) | 2.1V @ 7A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 1200V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 1.2KV 10A WAFER |
6.930 |
|
- | Standard | 1200V | 10A (DC) | 1.6V @ 10A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 1200V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 30A WAFER |
2.844 |
|
- | Standard | 600V | 30A (DC) | 1.95V @ 30A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -40°C ~ 175°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 30A WAFER |
3.006 |
|
- | Standard | 600V | 30A (DC) | 1.95V @ 30A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -40°C ~ 175°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 20A WAFER |
2.214 |
|
- | Standard | 600V | 20A (DC) | 1.7V @ 20A | Fast Recovery =< 500ns, > 200mA (Io) | 150ns | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 20A WAFER |
8.928 |
|
- | Standard | 600V | 20A (DC) | 1.7V @ 20A | Fast Recovery =< 500ns, > 200mA (Io) | 150ns | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 20A WAFER |
7.758 |
|
- | Standard | 600V | 20A (DC) | 1.7V @ 20A | Fast Recovery =< 500ns, > 200mA (Io) | 150ns | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 30A WAFER |
6.300 |
|
- | Standard | 600V | 30A (DC) | 1.6V @ 30A | Fast Recovery =< 500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -40°C ~ 175°C |
|
|
Infineon Technologies |
DIODE GEN PURP 1.2KV 15A WAFER |
5.652 |
|
- | Standard | 1200V | 15A (DC) | 1.6V @ 15A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 1200V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 1.7KV 200A WAFER |
7.794 |
|
- | Standard | 1700V | 200A (DC) | 1.8V @ 200A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 1700V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE SCHOTTKY 600V 4A WAFER |
2.358 |
|
- | Silicon Carbide Schottky | 600V | 4A (DC) | 1.9V @ 4A | No Recovery Time > 500mA (Io) | 0ns | 200µA @ 600V | 150pF @ 1V, 1MHz | Surface Mount | Die | Sawn on foil | -55°C ~ 175°C |
|
|
Infineon Technologies |
DIODE GEN PURP 1.2KV 15A WAFER |
3.312 |
|
- | Standard | 1200V | 15A (DC) | 1.9V @ 15A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 1200V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 1.2KV 15A WAFER |
6.354 |
|
- | Standard | 1200V | 15A (DC) | 2.1V @ 15A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 1200V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 1.2KV 25A WAFER |
8.604 |
|
- | Standard | 1200V | 25A (DC) | 1.6V @ 25A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 1200V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 50A WAFER |
3.132 |
|
- | Standard | 600V | 50A (DC) | 1.9V @ 50A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -40°C ~ 175°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 50A WAFER |
6.354 |
|
- | Standard | 600V | 50A (DC) | 1.9V @ 50A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -40°C ~ 175°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 30A WAFER |
5.004 |
|
- | Standard | 600V | 30A (DC) | 1.25V @ 30A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 30A WAFER |
7.434 |
|
- | Standard | 600V | 30A (DC) | 1.25V @ 30A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 45A WAFER |
3.870 |
|
- | Standard | 600V | 45A (DC) | 1.6V @ 45A | Fast Recovery =< 500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -40°C ~ 150°C |
|
|
Infineon Technologies |
DIODE GEN PURP 1.7KV 300A WAFER |
8.856 |
|
- | Standard | 1700V | 300A (DC) | 1.8V @ 300A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 1700V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |
|
|
Infineon Technologies |
DIODE SCHOTTKY 600V 5A WAFER |
6.912 |
|
- | Silicon Carbide Schottky | 600V | 5A (DC) | 1.7V @ 5A | No Recovery Time > 500mA (Io) | 0ns | 200µA @ 600V | 170pF @ 1V, 1MHz | Surface Mount | Die | Sawn on foil | -55°C ~ 175°C |
|
|
Infineon Technologies |
DIODE SCHOTTKY 600V 6A WAFER |
2.466 |
|
- | Silicon Carbide Schottky | 600V | 6A (DC) | 1.7V @ 6A | No Recovery Time > 500mA (Io) | 0ns | 200µA @ 600V | 300pF @ 1V, 1MHz | Surface Mount | Die | Sawn on foil | -55°C ~ 175°C |
|
|
Infineon Technologies |
DIODE GEN PURP 600V 75A WAFER |
7.452 |
|
- | Standard | 600V | 75A (DC) | 1.9V @ 75A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 600V | - | Surface Mount | Die | Sawn on foil | -40°C ~ 175°C |
|
|
Infineon Technologies |
DIODE GEN PURP 1.2KV 25A WAFER |
4.158 |
|
- | Standard | 1200V | 25A (DC) | 1.9V @ 25A | Standard Recovery >500ns, > 200mA (Io) | - | 27µA @ 1200V | - | Surface Mount | Die | Sawn on foil | -55°C ~ 150°C |