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The Cypress memory interface is included in the JEDEC xSPI electrical interface standard

dic 6 2017 2017-12 Semiconductors Cypress Semiconductor
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Cypress Semiconductor Corporation announced that its high-bandwidth Hyperbus 8-bit serial memory interface has been included in the new eXpandedSPI(xSPI) electrical interface standard developed by the JEDEC Solid-State Technology Association.

     Cypress Semiconductor Corporation announced that its high-bandwidth Hyperbus 8-bit serial memory interface has been included in the new eXpandedSPI(xSPI) electrical interface standard developed by the JEDEC Solid-State Technology Association. The xSPI standard defines compatibility requirements for high-performance x8 serial interfaces, enabling controller and chipset manufacturers to design universal storage controllers. The inclusion of the Cypress HyperBus interface in the JEDEC xSPI standard simplifies memory design based on HyperBus interfaces and provides system designers with more flexibility to enable instantaneous startup capabilities in automotive, industrial and iot applications.

     Cypress was one of the first flash memory vendors to see the need for a high-speed 8-bit bus market, releasing the HyperBus interface in 2014 to introduce a new generation of high-performance and flash and RAM solutions that enable instantaneous start-up capabilities for driverless and Industry 4.0 applications. Cypress's HyperBus-based memory offerings include high-density HyperFlashTM flash memory devices with the bandwidth required for the highest performance embedded systems, as well as high-speed HyperRAMTM Autorefresh Dynamic memory (DRAM) devices for systems requiring larger note-based memory (temporary memory).

     HowardSussman, Vice Chairman of the JEDEC Board of Directors, said, "Cypress has been a leading member of the JEDEC Working Committee driving the development of the xSPI standard. For system integrators, the JEDEC standard makes it easier to choose an alternative supplier for XSP-compatible flash memory devices. At the same time, the standard provides a uniform PCB package size and makes it possible to use a uniform device driver for all xSPI memory systems configured according to the standard xSPI method. 

     The xSPI standard defines compatibility requirements for high-performance x8 serial interfaces, including read and write commands, electrical characteristics, signal protocols for command and data transmission, and standard pin outputs in ball-grid array (BGA) packages. RainerHoehler, vice president of Cypress Flash, said: "We strongly believe that open industry standards published by renowned standards bodies such as JEDEC are the best way for products to gain broad market acceptance while delivering benefits to customers and suppliers. The inclusion of Cypress's HyperBus interface in the xSPI standard makes it easier for customers to achieve instantaneous system startup. '

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