TE Connectivity introduces microQSFP connectors to support next-generation data center infrastructure
TE Connectivity, the global leader in connectivity and sensors, announced the launch of its next-generation pluggable input/output (I/O) interconnect solution, the Micro four-channel Small Pluggable (microQSFP) product line. microQSFP connectors can help address key challenges in data storage centers, including bandwidth, thermal performance, and energy consumption. TE is the first member of the microQSFP Multi-Source Protocol (MSA) organization to bring microQSFP to market, creating a new ecosystem for microQSFP in the industry and ensuring smooth integration and adoption of the product in existing data center designs.
Growing consumer demand for video content delivery and streaming Internet services is placing higher demands on bandwidth, but the size of standard I/O connectors and external heatsinks in existing devices limit data throughput improvements. The microQSFP is able to achieve the same outstanding performance as the QSFP28, but in a smaller volume than the QSFP28, the same as the SFP, and provides better thermal performance to save energy. At the same time, the product line not only improves the electronic performance to 25Gbps per channel, but also increases the contact density by 33% over the QSFP to accommodate more ports on a single standard line card.
Phil Gilchrist, Chief Technology Officer of TE's Data and End Devices division, said: "TE's microQSFP products not only meet the ever-increasing demands of the market for panel size and thermal performance, but also lead the connector industry by supporting a maximum capacity of 100Gbps per 72 ports on a 1RU line card."
The new microQSFP meets the needs of next-generation designs with 56Gbps transmission performance per channel and 28Gbps backward compatibility per channel. Its built-in heat sink integrates the functionality of additional clips and heat sink parts, and helps enable panel air flow inside the device, enabling the microQSFP to achieve better thermal performance than existing advanced solutions such as the QSFP28.
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