TDK introduces CeraPad's ultra-thin substrate with integrated ESD protection

     TDK Group introduces the new ultra-thin ceramic substrate CeraPad, which is designed with multiple layers and integrates ESD protection without the need for separate ESD components. This innovative substrate meets the needs of extreme miniaturization and also offers the best ESD protection for maximum integrated ESD protection in sensitive applications.

     CeraPad ceramic substrate ESD protection capacity of up to 25 kV, while the current most advanced Zener diode standard protection capacity of only 8 kV, CeraPad ceramic substrate ESD protection capacity is better than traditional products three times. In addition, the ceramic substrate is only 300 µm to 400 µm thick, but has a thermal conductivity of up to 22 W/mK, which is also more than three times that of traditional carriers. CeraPad's contact pads can be designed according to the requirements of the welding process and can be adapted to the standard SAC(Sn/Ag/Cu, 260 °C) reflow or eutectic welding (AuSn, 320 °C) process.

     With the increasing number and density of leds per unit, this new technology is particularly suitable for a variety of LED applications. CeraPad can reduce the standard LED component Custom Chip Specification package (CSP) from CSP1515 to CSP0707. In addition, CeraPad also has an extremely low coefficient of thermal expansion (6 ppm/mK), which is almost the same as that of leds. Therefore, when the temperature changes, there is almost no mechanical stress between the substrate and the LED.

     Similar to PCB boards, the multi-layer technology of CeraPad ceramic substrates can also be redistributed to connect each layer inside through perforation, thus designing some kind of integrated circuit. In general, today's matrix leds contain multiple dual leds in series. In contrast, the new CeraPad module enables, for the first time, a new type of LED array in which hundreds of LED light source points can be independently controlled. Application designers will be able to use this technology to create innovative high-resolution and safe lighting effects in the smallest Spaces, such as multi-LED flash on smartphones, or adaptive headlights in cars.

     With the CeraPad ceramic substrate, TDK Group is able to offer its customers an attractive custom packaging solution that allows them to better face the challenges of the rising IC sensitivity of the future, allows customers to take advantage of a completely new way of lighting design, and also improves the lighting efficiency of leds.