New products on geothermal curing, gap pads and dispensable gels

     Parker Hannifin Corporation's chemistry division demonstrated three new thermal interface materials at Electronica 2024. Innovative products on display include new thermal curing, gap pads and dispensable gel products. The company also plans to make a splashy announcement involving the launch of a rapid sampling and prototyping service.

     With the evolving needs and trends of the electronics industry, the company strives to stay ahead of the competition by developing timely solutions to meet emerging challenges. The new thermal interface materials on display maximize thermal management performance in some of the most demanding applications, overcoming key industry issues such as oil leakage, vertical viscosity and the limitations of hard curing dispensability.

     Thermal interface materials transfer heat away from electronic components and other heating devices. They also fill in gaps in some applications. The new THERM-A-FORM CIP 60 curable in place material and thermal gap filler is a good example. With its high thermal conductivity of 6W/m-K, the new product not only provides an alternative material for hard curing in electronic cooling applications, but also improves on standard application methods related to thermal gap filling pads.

     Visitors will find that this two-component material can provide an exceptional flow rate to meet the dispensing needs of large volumes. Electric vehicle systems, automotive infotainment, automotive ADAS, and consumer and enterprise SSDS can all benefit from the THERM-A-FORM CIP 60.

     The company will also demonstrate its new THERM-A-GAP 80LO high-performance thermal gap pad with very low oil leakage and migration characteristics. Ideal aesthetics or silicone oil manufacturing issues are an issue, and the new gap pads offer a typical thermal conductivity of 8W/m-K. Compressible thermal elastomers conduct heat in the gap between the heating surface (such as a semiconductor or battery) and the cooling surface.

     Thermal gap pads minimize stress on components such as integrated circuits and provide physical protection such as vibration reduction. Applications include Gpus, cpus, memory modules, 5G, telecommunications equipment, etc. Automotive sensors, devices, battery and energy storage modules, and defense electronics can also benefit.

     Another new product highlight will be THERM-GAP GEL 75VT, a high-performance alternative thermal gel with the typical thermal conductivity of 7.5W/m-K and vertical viscosity for demanding mission-critical applications. In the long-term reliability test, the new material has passed the automotive vertical slump test, high vibration test and telecom thermal material verification process.

     Single-component thermal gels are ideal for automotive sensors and devices, telecommunications modules, BESS modules, industrial electronics, networking and IT infrastructure, power electronics and consumer electronics. The user can dispense hot gel in the adhesive line thickness up to 4mm.