Lattice Semiconductor introduces the new CrossLink Programmable ASPP (pASSP) IP solution
Lattice Semiconductor, a leading provider of customized intelligent interconnect solutions to the market, announced the launch of the new Lattice CrossLink Programmable ASSP(pASSP)IP solution. With three new CrossLink ips and two CrossLink demo platforms that support MIPI® DSI to LVDS and CMOS to MIPI CSI-2 Bridges, design engineers can implement new video bridging capabilities. Lattice is committed to providing bridging solutions for consumer, industrial and automotive applications, and the company has optimized its existing CrossLink IP to save logic resources and reduce power consumption.
The CrossLink product family is designed to address the challenges posed by today's rapidly evolving I/O needs, providing design engineers with a new way to develop high-performance, low-power, and small-size bridging solutions. Although the product family has been on the market for less than a year, we have already seen strong customer interest in this product, which extends well beyond the typical early application scenarios such as image sensors, application processors and easy interface conversion, signal aggregation and multiplexing between displays.
By continuously optimizing existing IP and introducing new IP, development platforms and additional resources, Lattice is able to provide solutions for more bridging applications, leveraging the benefits of FPgas for faster time-to-market and ASSPs for power consumption and function optimization.
C.H. Chee, Senior Director of Marketing, Mobile and Consumer Electronics, Lattice Semiconductor, said: "The new CrossLink IP and solutions enable our customers to adopt cameras and displays with the latest mobile interface technology, reducing overall system cost, power consumption and size while shortening the design cycle for next-generation products. "As the inventor of the industry's first programmable bridging device and the world's fastest MIPI D-PHY bridging device, Lattice is committed to providing low-cost bridging solutions with the highest bandwidth, lowest power consumption and smallest size."
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