3M's carrier bags and cover straps are precision manufactured to help minimize chip migration and cracking

     3M's polycarbonate carrier tape is available in a range of precision-manufactured designs and solutions to help minimize chip migration and cracking and help reduce pickup failures. Carrier bag size has decreased dramatically in less than a decade. With the growing demand for smaller, thinner components and multi-chip stacks, as well as the need for individual chip tracking, true success of wafer level chip scale packaging (WLCSP) requires effective solutions from storage and shipping to the customer.

     3M's semiconductor chip transfer solution starts with carrier tape to help prevent chip migration in thin packaging applications. They also offer a comprehensive range of standard and custom cover straps and precision carrier straps to maximize production even for irregular chip sizes and pocket shapes.

     3M's load bag reduction element requires a sturdy load belt and precise bag formation to help reduce the risk of element tilting, flipping, or migrating, which can lead to element damage and downtime during pickup and drop. 3M offers a full range of non-conductive and electrostatic dissipative products and precision carrier designs for a variety of components.

     3M's cover strap seals 3M component carrier bags to help protect electrical and electronic components during transportation and storage. Its cover band provides excellent sealing performance and smooth peeling power, helping to ensure efficient pickup and drop operation. 3M's line of covers includes non-conductive and electrostatic dissipative products with thermal activation (HAA) or pressure sensitive adhesives (PSA).