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The development board now has microbus sockets that support click prototypes
2024-06
Power
MikroElektronika
[giu 14 2024] MIKROE has announced that 500 development board integrated microbus sockets are now available from top semiconductor manufacturers. The microbus development socket standard allows the use of any companies 1600+ compact Click peripheral board on the development board, greatly reducing embedded development time and prototyping. Nebojsa Matic, CEO of mikrooe, commented: "Since the beginning of the y ...
Micropackage step-down regulators available up to 20A
2024-06
Power
Recom Power
[giu 14 2024] Using the latest circuitry and manufacturing technology, RECOM offers a range of low-cost packaged step-down regulators in ultra-compact, heat-enhanced LGA and QFN packages with output current grades 1,3,10 and 20A. All of these products feature integrated magnetism, including remote on/off, good power signal, and comprehensive protection against input undervoltage, overtemperature, short circuit ...
Melexis released its Induxis switch
2024-06
Connectors
Melexis Technologies NV
[giu 14 2024] Melexis has released its Induxis switch MLX92442. Contactless, magnetically free, and anti-stray, this monolithic solution directly detects conductive targets. It allows for small modular designs that reduce the number of components to improve safety and electrification: high voltage interlocking, charging flaps, seat belts, hood/trunk, gear tooth sensing or line control motion applications. Mink ...
Marine devices powered by Tiger and Elkhart Lake processors
2024-06
Power
Intel
[giu 13 2024] Marine environments require durability to withstand some of the most extreme conditions that naval workstations and vessels can face, including extreme temperatures, high humidity levels, and volatile Marine turbulence that can cause shock and vibration. When selecting a hardened panel PC for a ship, it is important to evaluate the specific needs and environmental conditions of the application to ...
High-performance FPgas accelerate embedded design
2024-06
Connectors
Xilinx
[giu 13 2024] Ideal for highly integrated circuits in the Xilinx Artix-7 FPGA family, this high-performance FPGA product is designed for adaptability and superior performance in a variety of embedded system applications. Fpgas excel at handling a wide range of digital and mixed-signal tasks, from advanced networking and industrial automation to multimedia processing. It demonstrates its multiprotocol capabilit ...
A device customized for a variety of embedded system applications
2024-06
Connectors
Weidmuller
[giu 13 2024] WIN SOURCE MCHC908GR8CFAE MCU is a versatile, highly integrated device tailored for a variety of embedded system applications. It is a key member of the Freescale MC68HC908GR8 family and is designed to provide unmatched performance and flexibility to developers and designers. At the heart of the MCU's capabilities is its powerful CPU08 core, which ensures efficient operation in a variety of compu ...
The field of computing that drives innovation in industrial computing
2024-06
Power
Advanced Energy
[giu 13 2024] Advantech recently announced a strategic partnership with Qualcomm to revolutionize the edge computing space. This effort, which combines AI expertise, high-performance computing and industry-leading connectivity, will drive innovation in industrial computing. The collaboration builds an open and diverse edge AI ecosystem that leads best-in-class solutions tailored for AI applications. Miller Cha ...
The new entry-level MCU family offers best-in-class power consumption
2024-06
Connectors
Renesas Electronics America
[giu 12 2024] Renesas Electronics has introduced the RA0 family of MCUS based on the Arm Cortex-M23 processor. The new low-cost RA0 device delivers the industry's lowest overall power consumption for general-purpose 32-bit MCUS. The device consumes only 84.3μA/MHz current in operating mode and 0.82mA current in sleep mode. In addition, the company offers a software standby mode in the new mcu that reduces powe ...
Infineon Technologies has released XENSIV sensor shielding for Arduino
2024-06
Connectors
Infineon Technologies
[giu 12 2024] Infineon Technologies has released XENSIV Sensor Shield for Arduino, a multifunctional tool for evaluating smart sensor systems in smart homes and various consumer applications. This innovative shield includes a variety of sensors from the company's portfolio, as well as the SHT35 humidity and temperature sensor, which simplifies its functionality and enhances the design journey for Infineon's cu ...
Murata has unveiled its groundbreaking Type 2GT modul
2024-06
Passive Components
Murata
[giu 12 2024] Murata has introduced the breakthrough type 2GT module, a multi-band LoRa module that marks a significant leap forward in the development of iot devices that require multifunctional wireless connectivity. This highly integrated module stands out by providing a comprehensive solution to meet the complex needs of global certification standards, enabling seamless deployment across geographies and in ...
Reliability defense capacitors for demanding applications
2024-06
Passive Components
Kyocera
[giu 12 2024] Kyocera AVX has released its new TCD series DLA 04051 and COTS-Plus conductive polymer capacitors. These new high-reliability conductive polymer capacitors are designed for demanding aerospace, defense, and industrial applications, including ng power supplies and filter circuits, and comply with the new DLA 04051 defense specification. The series of conductive polymer capacitors are currently ava ...
Microchip Technology expands its serial SRAM product line
2024-06
Power
Microchip Technology
[giu 11 2024] To meet the common customer demand for larger and faster SRAM, Microchip Technology has expanded its serial SRAM product line to include greater densities of up to 4Mb and increased SPI/SQI speeds to 143MHz. The 2Mb and 4Mb devices are low-cost alternatives to traditional parallel SRAM products and include an optional battery backup switching circuit in the SRAM memory to retain data in the event ...