Technology Articles
Record 2.884
Pagina 230/241
Microsemi introduces a system management design tool for communication
2012-05
Semiconductors
Microsemi
[mag 4 2012] Microsemi Corporation introduces a set of system and power management design tools for high-availability wired and wireless communications infrastructure devices. New design tools include the Mixed Signal Power Manager (MPM) 4.0 reference design, which supports up to 64 power rails and mixed analog and digital point-of-loads (POL), as well as PMBus -based communication. The company also offers a ...
Diodes New MOSFET from board height halved
2012-05
Passive Components
Diodes Incorporated
[mag 3 2012] Diodes Incorporated introduces a range of high-efficiency N-channel and P-channel MOSFETs in thin DFN2020-6 packages. DFN2020H4 package DMP2039UFDE4, the height from the board is only 0.4 mm, the board area is only four square millimeters, is a P-channel device with a fixed voltage of -25V, the volume is 50% thinner than similar devices. The other MOSFETs in the same series using the DFN2020E pac ...
NXP Semiconductor announces new SOT1226 "Diamond" package
2012-05
Semiconductors
NXP
[mag 2 2012] NXP Semiconductors has released the new SOT1226 "Diamond" package, the world's smallest general-purpose logic package with a unique pad spacing design. Measuring just 0.8 x 0.8 x 0.35-mm, the new SOT1226 comes in a pin-free plastic package that is 25% smaller than the previous world's smallest logic package, the NXP SOT1115. Despite its smaller size, the SOT1226 has a pad spacing of 0.5-mm, which ...
Vishay's next generation D-series MOSFETs feature high performance metrics such as ultra-low on-resistance and ultra-low gate charge
2012-05
Passive Components
Vishay
[mag 1 2012] Vishay Intertechnology has announced the launch of the first component of its next-generation D-series high-voltage power MOSFETs. The new 400V, 500V, and 600V N-channel devices feature low on-resistance, ultra-low gate charge, and 3A to 36A currents in a variety of packages. The D-Series MOSFETs are based on a new high-voltage strip technology that enables new levels of efficiency and power dens ...
Renesas Mobile promotes LTE Cat-4 certification
2012-04
Connectors
Renesas Electronics America
[apr 30 2012] Renesas Mobile Corporation, a subsidiary of Renesas Electronics, a provider of advanced wireless communications semiconductor solutions and platforms, will show you: With its "smarter by design" architecture, how its world-leading SP2531 LTE triple mode modem expands performance to nearly 150Mbps in downloads to deliver LTE CAT-4 performance. The show, co-hosted with Ericsson, a leading provider ...
Intersil introduces LED Pico Projector system solutions
2012-04
Connectors
Renesas Electronics America
[apr 29 2012] Intersil Corporation today announced the launch of the world's lowest-cost PICo-QHD Pico projector system and the industry's smallest LED-based LCoS PICo projector solution that has reached production readiness. Developed for low-power and cost-sensitive embedded or companion Pico projector applications, Intersil PICO-QHD offers a fully integrated reference design that includes high-volume produc ...
Analog Devices introduces digital power controllers
2012-04
Connectors
Analog Devices
[apr 28 2012] Analog Devices, Inc. recently introduced the ADP1046, a digital power controller for high-efficiency AC-DC and isolated DC-DC power systems. The ADP1046 is a flexible controller with 7 PWM (pulse width modulation) logic outputs that can be easily programmed via an I2C interface and an easy-to-use graphical user interface (GUI). The device can be used to control and drive most power supply topolog ...
TDK develops TDK laminated ceramic chip capacitors for on-board, X8R characteristics
2012-04
Passive Components
TDK
[apr 27 2012] TDK Corporation has developed TDK laminated ceramic chip capacitors for in-vehicle, X8R characteristics and announced the start of mass production and sales from April 2012. Through the development of dielectric materials that maintain excellent reliability and temperature characteristics even in the harsh temperature environment of 150 ° C, the electrical capacity of the product was successfully ...
Vishay introduces the TSMP6000 and TSMP77000 infrared receivers
2012-04
Power
Vishay
[apr 26 2012] Vishay Intertechnology, Inc. announced the introduction of two infrared receivers specifically developed for general purpose 3D television glasses, the TSMP6000 and TSMP77000, expanding its optoelectronics portfolio. Most LCD 3D TVS sold on the market today use shutter glasses that separate the images from the left and right eyes. Despite many efforts to standardize the technology used to synchro ...
ON Semiconductor introduces a new family of switching step-down regulators such as NCV890100
2012-04
Connectors
ON Semiconductor
[apr 25 2012] ON Semiconductor introduces a new line of switching step-down regulators for space-constrained, electromagnetic compatibility (EMC) -sensitive automotive entertainment and infotainment system applications. These highly integrated devices provide industry-leading conversion ratios for switching power supplies connected to batteries. NCV890100, NCV890101, NCV890130, NCV890131, NCV890200, NCV890201, ...
Molex expands its innovative circular hybrid technology connector system
2012-04
Connectors
Molex
[apr 24 2012] Molex extends its innovative Brad Micro-Change M12 Circular Hybrid Technology (CHT) connector system New 8-pole (4+4) connector products with two pairs of Cat5e twisted-pair data cables and four power cords capable of carrying up to 6.0 A current. The Brad Micro-Change CHT connector system combines power and data cables in a single connector, cutting cabling requirements and reducing installation ...
Renesas Electronics introduces high-performance, compact SoCs for multi-mode high-end set-top boxes
2012-04
Power
Renesas Electronics America
[apr 23 2012] Renesas Electronics announced the launch of a new system-on-a-chip (SoC) for high-end set-top boxes (STBS), the R-Home S1, which supports worldwide digital TV broadcast reception and Internet content distribution. Renesas Electronics regards STB-oriented SoCs as a strategic product for its SoC business, and vigorously promotes this business. In February 2011, Renesas shipped 100 million STB SoCs. ...