Technology Articles
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Diodes introduces 1.9W Class D audio amplifier
2015-06
Connectors
Diodes Incorporated
[giu 19 2015] Diodes Inc. introduced the PAM8905, a 1.9W Class D audio amplifier for smartphones powered by single-cell lithium-ion batteries, suitable for audio systems that provide high voltage level horizontal output at low supply voltage. The new product generates the voltage rail of the output stage through the built-in boost converter, and at the same time, the battery tracking automatic gain control fun ...
Vishay introduces new 600V and 650V FRED Pt Gen 4 Ultrafast fast recovery diodes
2015-06
Passive Components
Vishay
[giu 19 2015] Vishay Intertechnology announced the launch of 28 new 600V and 650V FRED Pt Gen 4 Ultrafast fast recovery diodes for high frequency converters in power modules, motor drives, UPS, solar inverters and welder inverters. The "H" and "U" series of devices from Vishay Semiconductors, available in bare crystal form in wafers, have ultra-low forward voltage and reverse recovery charge to reduce losses a ...
Qualcomm introduces the first next-generation hybrid networking and a new low-cost HomePlug AV2 SISO solution
2015-06
Power
Qualcomm
[giu 18 2015] Qualcomm Inc. announced that its subsidiary, Qualcomm Innovations, has introduced the industry's first hybrid wireless range extender and 802.11ac standard Wi-Fi technology using Qualcomm Atheros' HomePlug leading AV2 (HPAV2) Multiple input/Multiple Output (MIMO) powerline. The company also announced a new HomePlug AV2 Single input/Single Output (SISO) solution to enable reliability for mainstrea ...
Marvell introduces Avastar 88W8997
2015-06
Power
Maxwell Technologies
[giu 18 2015] Marvell announced the Avastar 88W8997. The product is the industry's smallest and most energy-efficient MU-MIMO wireless interconnect combo chip for both enterprise and consumer markets. The 88W8997 is the industry's first 28nm 2 x 2 802.11ac Wave-2 combo chip with full support for Bluetooth 4.2 and future Bluetooth 5.0. Philip Poulidis, vice president, general manager of Marvell's Wireless and I ...
Molex announces Brad Micro-Push M12 connectors for factory automation and industrial lighting applications
2015-06
Connectors
Molex
[giu 17 2015] Molex Corporation announces Brad Micro-Push M12 connectors for factory automation and industrial lighting applications. The connector is equipped with an innovative push-in and push-out interface, which reduces installation time by up to 80% compared to screw connectors, and allows convenient blind insertion connections in limited Spaces. The solution is constructed without any metal components t ...
Dialog introduces two power control IC products
2015-06
Connectors
Dialog Semiconductor GmbH
[giu 17 2015] Dialog Semiconductor Corporation announced the launch of two power control ics, the iW1818 and iW1830, which not only significantly improve the reliability of white goods power systems, but also reduce material (BOM) costs. These two digital power control ics can be used in dishwashers, refrigerators, stoves, microwave ovens, and other high-volume home appliance systems. The white goods market is ...
Broadcom has introduced a new Bluetooth Smart system-on-a-chip (SoC) product
2015-06
Power
Broadcom
[giu 16 2015] Broadcom announced the launch of a new Bluetooth Smart system-on-a-chip (SoC) product, adding to its Wireless Internet Connectivity for Embedded Devices (WICED™) portfolio. Broadcom's WICED Smart Ready SoC doubles speed over Bluetooth Smart connections, dramatically improving performance and extending the battery life of Internet of Things (IoT) devices. By integrating Bluetooth and Bluetooth Sma ...
Renesas Multi-function microcontroller RL78 / G1F adds 20 new members
2015-06
Connectors
Renesas Electronics America
[giu 16 2015] Renesas Electronics announces the multi-function microcontroller RL78 / G1F Group Controller (MCU), adding 20 new members to the low-power RL78 family of MCUS. The entire RL78 / G1X series MCU features enhanced peripheral functionality and compatibility, and the new device simplifies sensorless brushless direct current motor (BLDC motor) control to provide precise operation at faster rotation spe ...
Power Integrations announced the launch of the next generation of its CAPZero family of innovative double-terminal X capacitor discharge ics
2015-06
Power
Power Integrations
[giu 15 2015] Power Integrations announced the launch of the CAPZero™-2 IC, the next generation device in its CAPZero family of innovative double-terminal X-capacitor discharge ics. The CAPZero-2 IC covers a wide range of applications and output power for increased design flexibility. Covering a wide range of X capacitors from 0.1 µF to 6 µF, and with a breakdown voltage rated at 1 kV to withstand transient vo ...
Vishay introduces new SMD packaged ultra-thin drives
2015-06
Passive Components
Vishay
[giu 15 2015] Vishay Intertechnology has announced the launch of the VOL3120, an ultra-thin 2.5A IGBT and MOSFET driver in a new SMD package. Vishay Semiconductors is a small footprint with a height of 2.5mm and a minimum clearance and external creepage distance of 8mm. In addition to its small size, the high isolation voltage of the VIORM and VIOTM, 1050V and 8000V respectively, makes it ideal for operating a ...
ON Semiconductor introduces a full line of double data Rate (DDR) terminal regulators
2015-06
Semiconductors
ON Semiconductor
[giu 14 2015] ON Semiconductor further strengthens its Low Voltage drop (LDO) linear regulator portfolio with a new series of high-performance devices to support double data rate (DDR) memory. NCP51200, NCP51400, NCP51510 and NCP51199 use built-in power MOSFETs, Specific applications such as SDRAM DIMM memory, servers, routers, smartphones, tablet platforms, set-top boxes, smart TVS, printers and PC/laptop mot ...
Cypress introduces high-performance synchronous SRAM with on-chip error correction codes
2015-06
Semiconductors
Cypress Semiconductor
[giu 14 2015] Cypress Semiconductor Corporation announced the industry's highest capacity synchronous SRAM with on-chip error correction code (ECC). The new 36Mb synchronous SRAM integrates ECC capabilities to provide the highest level of data reliability and simplify the design of a variety of military, communications and data processing applications. Cypress plans to expand its synchronous SRAM line with ECC ...