NXP PMIC - Gestione alimentazione - Specializzata
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CategoriaSemiconduttori / CI di gestione dell'alimentazione / PMIC - Gestione alimentazione - Specializzata
ProduttoreNXP USA Inc.
Record 595
Pagina 20/20
Immagine |
Numero parte |
Produttore |
Descrizione |
Disponibile |
Quantità |
Serie | Applicazioni | Corrente - Alimentazione | Tensione - Alimentazione | Temperatura di esercizio | Tipo di montaggio | Pacchetto / Custodia | Pacchetto dispositivo fornitore |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NXP |
SBC 5V 1CAN 1LIN 6SG HLQFP48 |
5.436 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 3V 1CAN 0LIN 6SG HLQFP48 |
7.470 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 3V 1CAN 0LIN 6SG HLQFP48 |
5.742 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 3V 1CAN 0LIN 6SG HLQFP48 |
5.418 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC SG 1 CAN 0 LIN HLQFP48 |
2.970 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC SG 1 CAN 0 LIN HLQFP48 |
7.830 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 3V 1CAN 0LIN 6SG HLQFP48 |
7.416 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 3V 1CAN 0LIN 6SG HLQFP48 |
7.920 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 5V 1CAN 4LIN 6SG HLQFP48 |
5.976 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
SBC 5V 1CAN 4LIN 6SG HLQFP48 |
5.922 |
|
- | System Basis Chip | 7mA | 3.5V ~ 28V | -40°C ~ 125°C | Surface Mount | 48-LQFP Exposed Pad | 48-LQFP-EP (7x7) |
|
|
|
NXP |
POWER MANAGEMENT IC 3 BUCK REGS |
5.958 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
POWER MANAGEMENT IC 3 BUCK REGS |
3.798 |
|
- | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 105°C | Surface Mount | 40-VFQFN Exposed Pad | 40-HVQFN (5x5) |
|
|
|
NXP |
32BIT256K FLASHSTR CTM |
3.060 |
|
- | General Purpose | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
|
|
|
NXP |
32BIT256K FLASHSTR CTM |
7.758 |
|
- | General Purpose | - | 2.7V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 64-LQFP | 64-LQFP (10x10) |
|
|
|
NXP |
IC WIRELESS PWR RECEIVER WLCSP42 |
4.554 |
|
- | Wireless Power Receiver | 12mA | 6.1V ~ 18V | -40°C ~ 85°C | Surface Mount | 42-UFBGA, WLCSP | 42-WLCSP (3.56x3.41) |
|
|
|
NXP |
IC WIRELESS PWR RECEIVER WLCSP42 |
3.690 |
|
- | Wireless Power Receiver | - | - | -40°C ~ 85°C | Surface Mount | 42-UFBGA, WLCSP | 42-WLCSP (3.56x3.41) |
|
|
|
NXP |
IC WIRELESS PWR RECEIVER |
6.030 |
|
- | Wireless Power Receiver | 12mA | 6.1V ~ 18V | -40°C ~ 85°C | Surface Mount | 42-UFBGA, WLCSP | 42-WLCSP (3.56x3.41) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
3.384 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
3.366 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
2.376 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QXP |
8.532 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
6.264 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT |
3.582 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
3.472 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
|
|
|
NXP |
IC POWER MANAGEMENT I.MX8QM |
4.392 |
|
- | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |