Micron Technology Inc. Memoria
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CategoriaSemiconduttori / Circuiti integrati di memoria / Memoria
ProduttoreMicron Technology Inc.
Record 8.604
Pagina 283/287
Immagine |
Numero parte |
Produttore |
Descrizione |
Disponibile |
Quantità |
Serie | Tipo di memoria | Formato memoria | Tecnologia | Dimensione della memoria | Interfaccia di memoria | Frequenza di clock | Tempo di ciclo di scrittura - Parola, pagina | Tempo di accesso | Tensione - Alimentazione | Temperatura di esercizio | Tipo di montaggio | Pacchetto / Custodia | Pacchetto dispositivo fornitore |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Micron Technology Inc. |
MASSFLASH/CONTROLLER 256G |
3.186 |
|
* | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Micron Technology Inc. |
EMCP 256G |
5.148 |
|
* | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
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|
Micron Technology Inc. |
IC FLASH 256G MMC |
7.362 |
|
e•MMC™ | Non-Volatile | FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | - | -40°C ~ 105°C (TA) | Surface Mount | 153-TFBGA | 153-TFBGA (11.5x13) |
|
|
|
Micron Technology Inc. |
IC FLASH 256G MMC |
4.068 |
|
e•MMC™ | Non-Volatile | FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | - | -40°C ~ 85°C (TA) | Surface Mount | 153-TFBGA | 153-TFBGA (11.5x13) |
|
|
|
Micron Technology Inc. |
IC FLASH 256G MMC |
6.012 |
|
e•MMC™ | Non-Volatile | FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | - | -40°C ~ 105°C (TA) | Surface Mount | 100-TBGA | 100-TBGA (14x18) |
|
|
|
Micron Technology Inc. |
IC FLASH 256G MMC |
4.806 |
|
e•MMC™ | Non-Volatile | FLASH | FLASH - NAND | 256Gb (32G x 8) | MMC | - | - | - | - | -40°C ~ 85°C (TA) | Surface Mount | 100-TBGA | 100-TBGA (14x18) |
|
|
|
Micron Technology Inc. |
IC FLASH 512G MMC |
7.974 |
|
e•MMC™ | Non-Volatile | FLASH | FLASH - NAND | 512Gb (64G x 8) | MMC | - | - | - | - | -25°C ~ 85°C (TA) | - | - | - |
|
|
|
Micron Technology Inc. |
MASSFLASH/CONTROLLER 512G |
7.812 |
|
* | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Micron Technology Inc. |
IC FLASH 512G MMC |
2.988 |
|
e•MMC™ | Non-Volatile | FLASH | FLASH - NAND | 512Gb (64G x 8) | MMC | - | - | - | - | -40°C ~ 105°C (TA) | Surface Mount | 153-TFBGA | 153-TFBGA (11.5x13) |
|
|
|
Micron Technology Inc. |
IC FLASH 512G MMC |
4.806 |
|
e•MMC™ | Non-Volatile | FLASH | FLASH - NAND | 512Gb (64G x 8) | MMC | - | - | - | - | -40°C ~ 85°C (TA) | Surface Mount | 153-TFBGA | 153-TFBGA (11.5x13) |
|
|
|
Micron Technology Inc. |
EMMC 512GBIT MMC5.1 J58X AAT |
2.880 |
|
* | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Micron Technology Inc. |
EMMC 512GBIT MMC5.1 J58X AAT |
3.654 |
|
* | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Micron Technology Inc. |
EMMC 512GBIT MMC5.1 J58X AT |
8.010 |
|
* | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Micron Technology Inc. |
EMMC 512GBIT MMC5.1 J58X AT |
6.822 |
|
* | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Micron Technology Inc. |
IC FLASH 64G MMC |
7.020 |
|
e•MMC™ | Non-Volatile | FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | - | -40°C ~ 105°C (TA) | Surface Mount | 153-TFBGA | 153-TFBGA (11.5x13) |
|
|
|
Micron Technology Inc. |
IC FLASH 64G MMC |
3.636 |
|
e•MMC™ | Non-Volatile | FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | - | -40°C ~ 85°C (TA) | Surface Mount | 153-TFBGA | 153-TFBGA (11.5x13) |
|
|
|
Micron Technology Inc. |
IC FLASH 64G MMC |
6.750 |
|
e•MMC™ | Non-Volatile | FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | - | -40°C ~ 105°C (TA) | Surface Mount | 100-TBGA | 100-TBGA (14x18) |
|
|
|
Micron Technology Inc. |
IC FLASH 64G MMC |
2.448 |
|
e•MMC™ | Non-Volatile | FLASH | FLASH - NAND | 64Gb (8G x 8) | MMC | - | - | - | - | -40°C ~ 85°C (TA) | Surface Mount | 100-TBGA | 100-TBGA (14x18) |
|
|
|
Micron Technology Inc. |
LPDDR3 4G DIE 128MX32 |
7.074 |
|
* | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Micron Technology Inc. |
LPDDR3 4G DIE 128MX32 |
6.606 |
|
* | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Micron Technology Inc. |
LPDDR3 6G DIE 192MX32 |
4.032 |
|
* | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Micron Technology Inc. |
IC DRAM 8G PARALLEL |
3.222 |
|
- | Volatile | DRAM | SDRAM - Mobile LPDDR3 | 8Gb (512M x 16) | Parallel | - | - | - | 1.14V ~ 1.95V | - | - | - | - |
|
|
|
Micron Technology Inc. |
IC FLASH TLC 256GBIT 32GX8 |
2.772 |
|
* | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Micron Technology Inc. |
IC FLASH TLC 256GBIT 32GX8 |
5.292 |
|
* | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
|
Micron Technology Inc. |
IC FLASH 128M SPI 133MHZ 8SOP2 |
5.886 |
|
- | Non-Volatile | FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 1.7V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.209", 5.30mm Width) | 8-SOP2 |
|
|
|
Micron Technology Inc. |
IC FLASH 128M SPI 133MHZ 24TBGA |
6.948 |
|
- | Non-Volatile | FLASH | FLASH - NOR | 128Mb (16M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 1.7V ~ 2V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TBGA (6x8) |
|
|
|
Micron Technology Inc. |
IC FLASH 128M PARALLEL 56VFBGA |
7.974 |
|
- | Non-Volatile | FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 60ns | 60ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | - | - |
|
|
|
Micron Technology Inc. |
IC FLASH 256M SPI 108MHZ 16SOP2 |
8.568 |
|
- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (64M x 4) | SPI | 108MHz | 8ms, 5ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP2 |
|
|
|
Micron Technology Inc. |
IC FLASH 256M SPI 133MHZ 16SOP2 |
6.480 |
|
- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOP2 |
|
|
|
Micron Technology Inc. |
IC FLASH 256M SPI 24TPBGA |
8.820 |
|
- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (32M x 8) | SPI | 133MHz | 8ms, 2.8ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-T-PBGA (6x8) |