Winbond Electronics Memoria
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CategoriaSemiconduttori / Circuiti integrati di memoria / Memoria
ProduttoreWinbond Electronics
Record 1.359
Pagina 29/46
Immagine |
Numero parte |
Produttore |
Descrizione |
Disponibile |
Quantità |
Serie | Tipo di memoria | Formato memoria | Tecnologia | Dimensione della memoria | Interfaccia di memoria | Frequenza di clock | Tempo di ciclo di scrittura - Parola, pagina | Tempo di accesso | Tensione - Alimentazione | Temperatura di esercizio | Tipo di montaggio | Pacchetto / Custodia | Pacchetto dispositivo fornitore |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Winbond Electronics |
IC FLASH 16M SPI 104MHZ 8SOIC |
24.452 |
|
SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 16Mb (2M x 8) | SPI | 104MHz | 3ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 24TFBGA |
8.604 |
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SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI | 104MHz | 50µs, 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 24TFBGA |
7.452 |
|
SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI | 104MHz | 50µs, 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 24-TBGA | 24-TFBGA (6x8) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8WSON |
6.246 |
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SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI | 104MHz | 50µs, 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8WSON |
2.538 |
|
SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI | 104MHz | 50µs, 3ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (6x5) |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 16SOIC |
5.652 |
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SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI | 104MHz | 60µs, 5ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
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Winbond Electronics |
IC FLASH 32M SPI 104MHZ 8WSON |
2.844 |
|
SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 32Mb (4M x 8) | SPI - Quad I/O, QPI | 104MHz | 60µs, 5ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-WDFN Exposed Pad | 8-WSON (8x6) |
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Winbond Electronics |
IC FLASH 4M SPI 80MHZ 8VSOP |
5.670 |
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SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 4Mb (512K x 8) | SPI | 80MHz | 800µs | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-VSOP |
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Winbond Electronics |
IC FLASH 8M SPI 80MHZ 8VSOP |
2.808 |
|
SpiFlash® | Non-Volatile | FLASH | FLASH - NOR | 8Mb (1M x 8) | SPI | 80MHz | 800µs | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-VSOP |
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Winbond Electronics |
IC DRAM 256M PARALLEL 168WFBGA |
3.996 |
|
- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 256Mb (8M x 32) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 256M PARALLEL 168WFBGA |
6.480 |
|
- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 256Mb (8M x 32) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 256M PARALLEL 168WFBGA |
7.326 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 256Mb (16M x 16) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 256M PARALLEL 168WFBGA |
5.004 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 256Mb (16M x 16) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 168WFBGA |
4.896 |
|
- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (64M x 32) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 168WFBGA |
5.922 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (64M x 32) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 134VFBGA |
7.200 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (64M x 32) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 134VFBGA |
2.178 |
|
- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (64M x 32) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 168WFBGA |
5.742 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (128M x 16) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 168WFBGA |
5.364 |
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- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (128M x 16) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 168-WFBGA | 168-WFBGA (12x12) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 134VFBGA |
5.058 |
|
- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (128M x 16) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -25°C ~ 85°C (TC) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
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Winbond Electronics |
IC DRAM 2G PARALLEL 134VFBGA |
3.042 |
|
- | Volatile | DRAM | SDRAM - Mobile LPDDR2 | 2Gb (128M x 16) | Parallel | 400MHz | 15ns | - | 1.14V ~ 1.95V | -40°C ~ 85°C (TA) | Surface Mount | 134-VFBGA | 134-VFBGA (10x11.5) |
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Winbond Electronics |
IC FLASH 128M PARALLEL 56TFBGA |
5.256 |
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- | Non-Volatile | FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFBGA | 56-TFBGA (7x9) |
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Winbond Electronics |
IC FLASH 128M PARALLEL 56TFBGA |
4.212 |
|
- | Non-Volatile | FLASH | FLASH - NOR | 128Mb (16M x 8, 8M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFBGA | 56-TFBGA (7x9) |
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Winbond Electronics |
IC FLASH 256M PARALLEL 64LFBGA |
7.434 |
|
- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (32M x 8, 16M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-LFBGA (11x13) |
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Winbond Electronics |
IC FLASH 256M PARALLEL 64LFBGA |
2.052 |
|
- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (32M x 8, 16M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-LFBGA (11x13) |
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Winbond Electronics |
IC FLASH 256M PARALLEL 64LFBGA |
7.380 |
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- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-LFBGA (11x13) |
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Winbond Electronics |
IC FLASH 256M PARALLEL 56TFBGA |
3.436 |
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- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFBGA | 56-TFBGA (7x9) |
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Winbond Electronics |
IC FLASH 256M PARALLEL 64LFBGA |
6.642 |
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- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 64-LBGA | 64-LFBGA (11x13) |
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Winbond Electronics |
IC FLASH 256M PARALLEL 56TFBGA |
3.492 |
|
- | Non-Volatile | FLASH | FLASH - NOR | 256Mb (16M x 16) | Parallel | - | 90ns | 90ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 56-TFBGA | 56-TFBGA (7x9) |
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Winbond Electronics |
IC DRAM 1G PARALLEL 96WBGA |
6.624 |
|
- | Volatile | DRAM | SDRAM - DDR3 | 1Gb (64M x 16) | Parallel | 800MHz | - | 20ns | 1.425V ~ 1.575V | -40°C ~ 95°C (TC) | Surface Mount | 96-TFBGA | 96-WBGA (9x13) |