The new top-cooled package enables maximum efficiency for power MOSFETs

     Infineon Technologies has introduced the SSO10T TSC package with optimmos MOSFET technology. With its direct top cooling concept, the package offers excellent thermal performance. This eliminates heat transfer to or through the PCB of the car's electronic control unit. The package enables a simple, compact double-sided PCB design that minimizes cooling requirements and system costs for future automotive power supply designs. Therefore, the SSO10T TSC is ideal for EPS, EMB, power distribution, BLDC, safety switches, reverse batteries, and DC-DC converters.

     The device has a footprint of 5mm x 7mm² and is based on the established industry standard SSO8 with a robust 5mm x 6mm² housing. However, depending on the thermal interface (TIM) material and the thickness of the TIM, its top cooling system performs 20 to 50 percent better than the standard SSO8. The package has been listed on the open market by jedec and offers a wide range of second-source compatibility. As a result, the kit can be quickly and easily introduced as future standard top cooling.

     At present, the first 40 V automotive MOSFET products using SSO10T are IAUCN04S6N007T, IAUCN04S6N009T, IAUCN04S6N013T and IAUCN04S6N017T. The SSO10T package allows for compact PCB design and reduced system footprint. It also reduces cooling design costs by eliminating through-holes, thereby reducing overall system costs and design effort. At the same time, the housing provides high power density and efficiency, supporting the development of future-oriented and sustainable vehicles.