Expanded surface mount and module package options for 1200V aSiC MOSFETs

     Alpha and Omega Semiconductor Inc. has expanded its package combination options for its second-generation 650V to 1200V aSiC MOSFETs. Suitable for many critical applications such as xEV charging, solar inverters and industrial power supplies, the new package options give designers additional flexibility with multiple system optimization options to further maximize system efficiency while simplifying their manufacturing process.

     The AOBB040V120X2Q is the company's new 1200V/40mOhm aSiC MOSFETs in a standard D2PAK-7L surface mount package. The product is AEC-Q101 certified and is designed to replace traditional through-hole packages. It is ideal for applications such as obc, where through holes and back PCB radiators can provide efficient cooling, simplify the assembly process and maximize power density. In addition, the low inductance package combined with fast driver source sensing connections makes these aSiC MOSFETs one of the most efficient power switching solutions on the market.

     For additional design flexibility, the company is releasing GTPAK surface mount packs with upper-layer cooling. In the design, a top-mounted radiator is feasible, with a direct heat path from the GTPAK minimising thermal resistance. It allows for higher power consumption and more efficient PCB routing. GTPAK's first product is the AOGT020V120X2. The 1200V/20mOhm aSiC MOSFET is the perfect solution for high efficiency solar inverters and industrial power applications.

     Finally, the company announced that the AOH010V120AM2 is the first product in its new AlphaModule family of high-power Baseboardless modules. This 1200V/10mOhm half-bridge aSiC module features a press-fit pin and integrated thermistor. It is a standard package module that allows multiple discrete devices to be replaced into a compact form factor, while simplifying mechanical and electrical design by providing a clear separation of electrical and cooling paths. A single module is ideal for residential solar inverters, or multiple modules in parallel will be able to scale up to the power levels needed to drive fast DC charging stations.

     "As electric vehicles, energy infrastructure and renewables continue to grow, our interest in aSiC MOSFETs continues to grow. The expansion of our portfolio to include these new advanced packaging options gives our customers the design flexibility they need to take advantage of our superior aSiC performance and continues to drive the trend toward higher density and efficiency in power systems, "said David Sheridan, vice president of SiC Products at AOS.