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Broadcom PAM4 physical layer chip shows strong momentum

mag 23 2015 2015-05 Semiconductors Broadcom
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Broadcom announced that its latest 40/50/100 Gigabit Ethernet (GbE) physical layer chip enables rapid adoption in pluggable QSFP+ fiber and DAC components. Several Oems and ODMs are already using the product in currently implemented projects

     Broadcom announced that its latest 40/50/100 Gigabit Ethernet (GbE) physical layer chip enables rapid adoption in pluggable QSFP+ fiber and DAC components. Several Oems and ODMs are already using the product in currently implemented projects

    To meet the growing demand for data traffic, network operators are looking for solutions that can leverage legacy cabling to improve data center cost and performance. Optimized for 40G four-channel Small Pluggable (QSFP) fiber and direct-connected copper (DAC) applications, Broadcom PAM4 devices enable 40/50Gbps transfer rates within existing infrastructure conditions.

     Lorenzo Longo, Broadcom's vice president and general manager of Physical Layer Products, said: "The rapid adoption and support of PAM4 technology by our leading customers and partners strengthens Broadcom's leading position in wired physical layer devices. "By transferring more bytes in a single signal, our devices are designed to increase data throughput in existing low-bandwidth channels, eliminating the need for expensive interconnecting media and significantly reducing costs."

     Chris Lyon, Amphenol Product Manager, said: "We are excited to work with Broadcom to deliver future-ready, leading technology with Broadcom's latest PAM4 product. By applying the BCM82004 to the 1X40G PAM4 QSFP implementation, we are able to meet our customers' expectations for superior performance, performance and scalability."

     ArashBehziz, technical specialist, TE System Architecture, said: "With Broadcom's new PAM4 technology, we are able to deliver unprecedented levels of performance, reliability and flexibility to our data center customers. The 40G direct copper cable will save costs, reduce infrastructure management issues, and help us succeed in the long term."

     Zach Bradford, Manager of New Product Development at Molex, said: "In the current competitive communications market environment, Broadcom and Molex have a long-standing partnership. "In conjunction with our Impel product line, Broadcom's new PAM4 technology supports high data rate applications and delivers superior performance, providing our customers with the ideal tool to increase data transfer speeds."

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