Interfaccia - Telecom
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CategoriaSemiconduttori / CI di interfaccia / Interfaccia - Telecom
Record 3.109
Pagina 35/104
Immagine |
Numero parte |
Produttore |
Descrizione |
Disponibile |
Quantità |
Serie | Funzione | Interfaccia | Numero di circuiti | Tensione - Alimentazione | Corrente - Alimentazione | Potenza (Watt) | Temperatura di esercizio | Tipo di montaggio | Pacchetto / Custodia | Pacchetto dispositivo fornitore |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
STACKABLE MANAGED SWITCH 24 PORT |
4.140 |
|
E-StaX-III-68 | - | - | - | - | - | - | - | - | - | - |
|
|
|
MaxLinear, Inc. |
IC JITTER ATTENUATOR 3CH 64TQFP |
4.950 |
|
- | Attenuator | Serial | 1 | 3.135V ~ 5.25V | 160mA | - | -40°C ~ 85°C | Surface Mount | 64-FQFP | 64-TQFP (10x10) |
|
|
|
IDT, Integrated Device Technology |
IC LINE INTERFACE UNIT 640BGA |
2.826 |
|
- | Line Interface Unit (LIU) | E1, J1, T1 | 1 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 640-BGA Exposed Pad | 640-TEPBGA (31x31) |
|
|
|
IDT, Integrated Device Technology |
IC LIU T1/J1/E1 21+1CH 640BGA |
6.768 |
|
- | Line Interface Unit (LIU) | E1, J1, T1 | 1 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 640-BGA Exposed Pad | 640-TEPBGA (31x31) |
|
|
|
Microchip Technology |
IC DIGITAL SWITCH 16K CH 256LQFP |
2.736 |
|
- | Switch | - | 1 | 1.71V ~ 1.89V | 240mA | - | -40°C ~ 85°C | Surface Mount | 256-LQFP | 256-LQFP (28x28) |
|
|
|
Microchip Technology |
IC CESOP PROCESSOR 32CH 324BGA |
8.064 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
|
|
|
Microchip Technology |
IC VOICE ECHO CANCELLER 208LBGA |
2.034 |
|
- | Echo Cancellation | - | 1 | 1.6V ~ 2V | 10mA | - | -40°C ~ 85°C | Surface Mount | 208-LBGA | 208-LBGA (17x17) |
|
|
|
MaxLinear, Inc. |
IC LIU E3/DS3/STS-1 4CH 176LQFP |
5.454 |
|
- | Line Interface Unit (LIU) | LIU | 4 | 3.135V ~ 3.465V | 450mA | - | -40°C ~ 85°C | Surface Mount | 176-LQFP | 176-LQFP (24x24) |
|
|
|
Microchip Technology |
IC CESOP PROCESSOR 64CH 324BGA |
2.016 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
|
|
|
Microchip Technology |
10GBE QUAD CH WAN/LAN XAUI TO XF |
8.514 |
|
- | Transceiver | Serial | 1 | 1.2V ~ 3.3V | - | 1W | - | Surface Mount | 324-BBGA, FCBGA | 324-FCBGA (19x19) |
|
|
|
MaxLinear, Inc. |
IC LIU E3/DS3/STS-1 6CH 217BGA |
5.418 |
|
- | Line Interface Unit (LIU) | LIU | 6 | 3.135V ~ 3.465V | 725mA | - | -40°C ~ 85°C | Surface Mount | 217-BBGA | 217-BGA (23x23) |
|
|
|
Microchip Technology |
LYNX-1, 12X1G+4X10G CARRIER ETHE |
6.948 |
|
LynX™-1 | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC CESOP PROCESSOR 128CH 552BGA |
1.296 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
|
|
|
Microchip Technology |
32CHANNEL T1/E1 FRAMER DEVICE WI |
476 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
32CHANNEL T1/E1 FRAMER DEVICE WI |
4.698 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC CESOP PROCESSOR 128CH 324BGA |
8.802 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 324-BGA | 324-PBGA (23x23) |
|
|
|
Microchip Technology |
JAGUAR-1, 24X1G+4X10G CARRIER ET |
7.362 |
|
Jaguar™-1 | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
DUAL/QUAD 10GBE PHY W/OTN-FEC |
3.420 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
DUAL/QUAD 10GE PHY W/OTN-FEC |
7.956 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
32 LINK, 256 HDLC CHANNEL FRAME |
2.718 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
32 CHANNEL T1/E1 FRAMER |
8.514 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
IC DGTL SWITCH F16KDX 272BGA |
8.604 |
|
- | Switch | - | 1 | 3V ~ 3.6V | 160mA | - | -40°C ~ 85°C | Surface Mount | 272-BGA | 272-PBGA (27x27) |
|
|
|
Microchip Technology |
IC CESOP PROC 256CH 552BGA |
5.904 |
|
- | Telecom Circuit | TDM | 1 | 1.65V ~ 1.95V | 950mA | - | -40°C ~ 85°C | Surface Mount | 552-BGA | 552-PBGA (35x35) |
|
|
|
Microsemi |
4X10GE TRANSCEIVER WITH OTN-FEC |
3.222 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
TELECOM INTERFACE ICS 32 LINK |
115 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
DUAL/QUAD 10GBE UNIV PHY W/OTN-F |
7.704 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
SINGLE-CHIP SONET/SDH TRANSPORT |
2.160 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
MaxLinear, Inc. |
IC LIU E3/DS3/STS-1 12CH 420TBGA |
2.755 |
|
- | Line Interface Unit (LIU) | LIU | 12 | 3.135V ~ 3.465V | - | - | -40°C ~ 85°C | Surface Mount | 420-LBGA | 420-TBGA (35x35) |
|
|
|
Microchip Technology |
HIGH DENSITY FRAMER/MAPPER FOR 8 |
2.538 |
|
* | - | - | - | - | - | - | - | - | - | - |
|
|
|
Microchip Technology |
TEMAP 84FDL GREEN DUAL PASSIVATI |
4.428 |
|
- | Framer | E1, T1 | - | - | - | - | - | - | - | - |