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CategoriaSemiconduttori / CI di interfaccia / Interfaccia - Specializzata

Record 3.987

Pagina 63/133

Numero parte	Produttore	Descrizione	Disponibile	Serie	Applicazioni	Interfaccia	Tensione - Alimentazione	Pacchetto / Custodia	Pacchetto dispositivo fornitore	Tipo di montaggio
ZSSC3170EA2T	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	8.352	*	-	-	-	-	-	-
ZSSC3170EE2T	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	3.996	*	-	-	-	-	-	-
ZSC31015EIG1-T	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	3.492	RBicLite™	Sensor Signal Conditioner - Resistive	ZACwire™ One-Wire Interface	2.7V ~ 30V	8-SOIC (0.154", 3.90mm Width)	8-SOIC	Surface Mount
ZSSC3154BA3R	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	2.610	Automotive, AEC-Q100	Sensor Signal Conditioner - Resistive	I²C, ZACwire™ One-Wire Interface	4.5V ~ 5.5V	32-VFQFN Exposed Pad	32-VFQFPN (5x5)	Surface Mount
ZSSC3154BA3V	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	7.938	Automotive, AEC-Q100	Sensor Signal Conditioner - Resistive	I²C, ZACwire™ One-Wire Interface	4.5V ~ 5.5V	32-VFQFN Exposed Pad	32-VFQFPN (5x5)	Surface Mount
MC33889BPEGR2	NXP	IC SYSTEM BASIS W/CAN 28SOIC	3.474	-	System Basis Chip	CAN	5V	28-SOIC (0.295", 7.50mm Width)	28-SOIC	Surface Mount
ZSSC3154BE3V	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	5.922	Automotive, AEC-Q100	Sensor Signal Conditioner - Resistive	I²C, ZACwire™ One-Wire Interface	4.5V ~ 5.5V	32-VFQFN Exposed Pad	32-VFQFPN (5x5)	Surface Mount
ZSSC3154BE3R	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	7.506	Automotive, AEC-Q100	Sensor Signal Conditioner - Resistive	I²C, ZACwire™ One-Wire Interface	4.5V ~ 5.5V	32-VFQFN Exposed Pad	32-VFQFPN (5x5)	Surface Mount
MCZ33903DP3EK	NXP	SYSTEM BASIS CHIP 2X 3.3 V/400M	5.364	-	System Basis Chip	CAN, LIN	5.5V ~ 28V	32-SSOP (0.295", 7.50mm Width) Exposed Pad	32-SOIC-EP	Surface Mount
MCZ33903DP5EK	NXP	SYSTEM BASIS CHIP 2X 5.0 V/400M	3.438	-	System Basis Chip	CAN, LIN	5.5V ~ 28V	32-SSOP (0.295", 7.50mm Width) Exposed Pad	32-SOIC-EP	Surface Mount
ZSC31150GEG1-T	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	5.094	*	-	-	-	14-SSOP (0.209", 5.30mm Width)	14-SSOP	Surface Mount
ZSC31050FEG1-R	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	3.114	Automotive, AEC-Q100	Sensor Signal Conditioner - Resistive	I²C, SPI, ZACwire™	2.7V ~ 5.5V	16-SSOP (0.209", 5.30mm Width)	16-SSOP	Surface Mount
MCZ33904D3EK	NXP	SYSTEM BASIS CHIP 2X 3.3 V/400M	5.436	-	System Basis Chip	CAN	5.5V ~ 28V	32-SSOP (0.295", 7.50mm Width) Exposed Pad	32-SOIC-EP	Surface Mount
MCZ33904D5EK	NXP	SYSTEM BASIS CHIP 2X 5.0 V/400M	5.400	-	System Basis Chip	CAN	5.5V ~ 28V	32-SSOP (0.295", 7.50mm Width) Exposed Pad	32-SOIC-EP	Surface Mount
MCZ33903D3EK	NXP	SYSTEM BASIS CHIP 2X 3.3 V/400M	5.562	-	System Basis Chip	CAN, LIN	5.5V ~ 28V	32-SSOP (0.295", 7.50mm Width) Exposed Pad	32-SOIC-EP	Surface Mount
MCZ33903D5EK	NXP	SYSTEM BASIS CHIP 2X 5.0 V/400M	4.536	-	System Basis Chip	CAN, LIN	5.5V ~ 28V	32-SSOP (0.295", 7.50mm Width) Exposed Pad	32-SOIC-EP	Surface Mount
ZSSC3135BA2T	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	4.896	*	-	-	-	-	-	-
ZSSC3015NA2T	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	8.928	*	-	-	-	-	-	-
MC33742PEG	NXP	IC SYSTEM BASE W/CAN 28SOIC	8.028	-	Automotive	SPI Serial	5.5V ~ 18V	28-SOIC (0.295", 7.50mm Width)	28-SOIC	Surface Mount
ZSC31150GLG1-T	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	7.362	*	-	-	-	-	-	-
MCZ33903DS3EK	NXP	SYSTEM BASIS CHIP LIN 2X 3.3 V	2.394	-	System Basis Chip	CAN, LIN	5.5V ~ 28V	32-SSOP (0.295", 7.50mm Width) Exposed Pad	32-SOIC-EP	Surface Mount
MCZ33903DS5EK	NXP	SYSTEM BASIS CHIPLIN 2X 5.0 V/	8.460	-	System Basis Chip	CAN, LIN	5.5V ~ 28V	32-SSOP (0.295", 7.50mm Width) Exposed Pad	32-SOIC-EP	Surface Mount
ZSC31150GEG2-V	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	8.982	*	-	-	-	-	-	-
ZSSC3131BE2T	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	3.996	*	-	-	-	-	-	-
MCZ33905DS3EK	NXP	SYSTEM BASIS CHIP LIN 2X 3.3 V	5.544	-	System Basis Chip	CAN, LIN	5.5V ~ 28V	32-SSOP (0.295", 7.50mm Width) Exposed Pad	32-SOIC-EP	Surface Mount
MCZ33905DS5EK	NXP	SYSTEM BASIS CHIP LIN 2X 5.0 V	3.598	-	System Basis Chip	CAN, LIN	5.5V ~ 28V	32-SSOP (0.295", 7.50mm Width) Exposed Pad	32-SOIC-EP	Surface Mount
ZSSC3136BA2T	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	7.092	Automotive, AEC-Q100	Sensor Signal Conditioner - Resistive	I²C, ZACwire™ One-Wire Interface	4.5V ~ 5.5V	14-SSOP (0.209", 5.30mm Width)	14-SSOP	Surface Mount
ZSC31015EEG1-T	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	3.600	RBicLite™	Sensor Signal Conditioner - Resistive	ZACwire™ One-Wire Interface	2.7V ~ 30V	8-SOIC (0.154", 3.90mm Width)	8-SOIC	Surface Mount
ZSSC5101BE4T	IDT, Integrated Device Technology	SENSOR SIGNAL CONDITIONER	4.356	*	-	-	-	-	-	-
MCZ33903DD3EK	NXP	SYSTEM BASIS CHIP 2 LIN 2X 3.3	6.930	-	System Basis Chip	CAN, LIN	5.5V ~ 28V	32-SSOP (0.295", 7.50mm Width) Exposed Pad	32-SOIC-EP	Surface Mount

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