Microchip Technology Memoria
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CategoriaSemiconduttori / Circuiti integrati di memoria / Memoria
ProduttoreMicrochip Technology
Record 9.021
Pagina 289/301
Immagine |
Numero parte |
Produttore |
Descrizione |
Disponibile |
Quantità |
Serie | Tipo di memoria | Formato memoria | Tecnologia | Dimensione della memoria | Interfaccia di memoria | Frequenza di clock | Tempo di ciclo di scrittura - Parola, pagina | Tempo di accesso | Tensione - Alimentazione | Temperatura di esercizio | Tipo di montaggio | Pacchetto / Custodia | Pacchetto dispositivo fornitore |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
IC EEPROM 2K SPI 3MHZ WAFER |
7.506 |
|
- | Non-Volatile | EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 6ms | - | 2.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER |
6.912 |
|
- | Non-Volatile | EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER |
8.298 |
|
- | Non-Volatile | EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER |
5.616 |
|
- | Non-Volatile | EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER |
7.902 |
|
- | Non-Volatile | EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER |
6.264 |
|
- | Non-Volatile | EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 4K SPI 3MHZ WAFER |
6.732 |
|
- | Non-Volatile | EEPROM | EEPROM | 4Kb (512 x 8, 256 x 16) | SPI | 3MHz | 6ms | - | 2.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER |
7.020 |
|
- | Non-Volatile | EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER |
4.392 |
|
- | Non-Volatile | EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER |
4.968 |
|
- | Non-Volatile | EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER |
4.194 |
|
- | Non-Volatile | EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER |
7.146 |
|
- | Non-Volatile | EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 8K SPI 3MHZ WAFER |
4.266 |
|
- | Non-Volatile | EEPROM | EEPROM | 8Kb (1K x 8, 512 x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER |
3.436 |
|
- | Non-Volatile | EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER |
4.662 |
|
- | Non-Volatile | EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER |
8.028 |
|
- | Non-Volatile | EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER |
5.094 |
|
- | Non-Volatile | EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER |
6.480 |
|
- | Non-Volatile | EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 16K SPI 3MHZ WAFER |
8.352 |
|
- | Non-Volatile | EEPROM | EEPROM | 16Kb (2K x 8, 1K x 16) | SPI | 3MHz | 5ms | - | 2.5V ~ 5.5V | 0°C ~ 70°C (TA) | Surface Mount | Die | Die |
|
|
|
Microchip Technology |
IC EEPROM 8K SPI 20MHZ 8WLCSP |
4.248 |
|
- | Non-Volatile | EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 20MHz | 5ms | - | 1.8V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | Die | Wafer |
|
|
|
Microchip Technology |
IC FLASH 2M SPI 40MHZ |
3.526 |
|
SST25 | Non-Volatile | FLASH | FLASH | 2Mb (256K x 8) | SPI | 40MHz | 3.5ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | - | Die | Wafer |
|
|
|
Microchip Technology |
IC FLASH 4M SPI 40MHZ |
3.420 |
|
SST25 | Non-Volatile | FLASH | FLASH | 4Mb (512K x 8) | SPI | 40MHz | 1ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | - | Die | Wafer |
|
|
|
Microchip Technology |
IC FLASH 8M SPI 40MHZ |
8.946 |
|
SST25 | Non-Volatile | FLASH | FLASH | 8Mb (1M x 8) | SPI | 40MHz | 1ms | - | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | - | Die | Wafer |
|
|
|
Microchip Technology |
IC FLASH 16M SPI 104MHZ |
2.502 |
|
SST26 SQI® | Non-Volatile | FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | Die | Wafer |
|
|
|
Microchip Technology |
IC FLASH 16M SPI 104MHZ |
5.994 |
|
SST26 SQI® | Non-Volatile | FLASH | FLASH | 16Mb (2M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | Die | Wafer |
|
|
|
Microchip Technology |
IC FLASH 64M SPI 104MHZ |
8.820 |
|
SST26 SQI® | Non-Volatile | FLASH | FLASH | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | Die | Wafer |
|
|
|
Microchip Technology |
IC FLASH 64M SPI 104MHZ |
8.982 |
|
SST26 SQI® | Non-Volatile | FLASH | FLASH | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | Die | Wafer |
|
|
|
Microchip Technology |
IC FLASH 64M SPI 104MHZ |
5.328 |
|
SST26 SQI® | Non-Volatile | FLASH | FLASH | 64Mb (8M x 8) | SPI - Quad I/O | 104MHz | 1.5ms | - | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | - | Die | Wafer |
|
|
|
Microchip Technology |
IC FLASH 8M PARALLEL |
2.682 |
|
SST39 MPF™ | Non-Volatile | FLASH | FLASH | 8Mb (512K x 16) | Parallel | - | 20µs | 70ns | 2.7V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | - | - |
|
|
|
Microchip Technology |
IC FLASH 4M PARALLEL |
4.356 |
|
SST39 MPF™ | Non-Volatile | FLASH | FLASH | 4Mb (256K x 16) | Parallel | - | 40µs | 70ns | 1.65V ~ 1.95V | -40°C ~ 85°C (TA) | - | Die | Wafer |