Microchip Technology Memoria
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CategoriaSemiconduttori / Circuiti integrati di memoria / Memoria
ProduttoreMicrochip Technology
Record 9.021
Pagina 134/301
Immagine |
Numero parte |
Produttore |
Descrizione |
Disponibile |
Quantità |
Serie | Tipo di memoria | Formato memoria | Tecnologia | Dimensione della memoria | Interfaccia di memoria | Frequenza di clock | Tempo di ciclo di scrittura - Parola, pagina | Tempo di accesso | Tensione - Alimentazione | Temperatura di esercizio | Tipo di montaggio | Pacchetto / Custodia | Pacchetto dispositivo fornitore |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
5.364 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
2.604 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
8.406 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
8.856 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
3.780 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
7.542 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
3.454 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
2.502 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
138 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CPGA |
252 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.97x16.51) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
119 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
8.154 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
7.848 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
3.474 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
6.750 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28FLATPK |
7.434 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 120ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
3.420 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 120ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
3.564 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
7.704 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CDIP |
3.402 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-CDIP (0.600", 15.24mm) | 28-CDIP |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
5.454 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 32LCC |
40 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-LCC (11.43x13.97) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CPGA |
3.456 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.97x16.51) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CPGA |
7.758 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.97x16.51) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CPGA |
5.400 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.97x16.51) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CPGA |
4.896 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.97x16.51) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CPGA |
3.060 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.97x16.51) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CPGA |
3.490 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.97x16.51) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CPGA |
6.390 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.97x16.51) |
|
|
|
Microchip Technology |
IC EEPROM 256K PARALLEL 28CPGA |
5.544 |
|
- | Non-Volatile | EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5V ~ 5.5V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.97x16.51) |